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Effect of Residual Primer on Microtensile Bond Strength and Degree of Conversion for Two-step Self-Etch Adhesive
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À±¾Æ³×½º ( Yun Agnes ) - Á¶¼±´ëÇб³ Ä¡ÀÇÇÐÀü¹®´ëÇпø Ä¡°úº¸Á¸Çб³½Ç
°½Âº¹ ( Kang Seung-Bok ) - Á¶¼±´ëÇб³ Ä¡ÀÇÇÐÀü¹®´ëÇпø Ä¡°úº¸Á¸Çб³½Ç
¹ÎÁ¤¹ü ( Min Jeong-Bum ) - Á¶¼±´ëÇб³ Ä¡ÀÇÇÐÀü¹®´ëÇпø Ä¡°úº¸Á¸Çб³½Ç
KMID : 0362220110380020141
Abstract
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Degree of conversion; Microthensile bond strength; Tesidual primer; Two-step Self-etch adhesives
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